Printed Circuit Boards: Rigid, Flex, and Flex-Rigid

Offshore PCB pricing with Domestic Support

The DiMaggio Technical Products Group partners with a major, offshore, PCB manufacturer employing over 850 people with revenue exceeding $102 Million from 4, capability focused factories covering all areas of PCB technology.

Rigid PCB:

Medium to high volume production
High mix low volume with quick turn

Flex PCB:

Flex and Flex/Rigid PCB

Categories:

HDI Technology
RF/HF PCBs with Rogers, Arlon & Taconic
Metal Clad PCBs
- Al & Cu Based
Heavy Copper PCBs (2-6 oz)
Blind/Buried & Via In Pad (VIP) PCBs
Depth Control PCBs

Domestic support presence:

Centrally located in the US
Stateside Engineering
- Immediate response to, “Can you do this?”
Stateside Quality Review
- Ability to Cross Section and Analyze
Stateside Customer Service
- Courteous and responsive
Stateside Same Day Quotes
Open order review
Warehouse Space for Local Stocking Programs

Product

Rogers Blind Slot PCBs

Layers: 10 layers
Max aspect ratio: 9:1
Min blind slot: 20*20mm
Min blind hole: 0.8mm
Min via hole: 0.8mm
Surface finishing: Immersion tin + OSP Phase difference: 2 degree
Range difference: +/-0.5 degree

Mix Laminating Multilayers PCBs

Max layers: 10 layers
Max board thickness: 4.0mm
Max size: 580*600mm
Max aspect ratio: 10:1
Min blind hole: 0.2mm
Copper thickness: 6OZ
Special technical: Countersunk hole
Mix Laminating: Aluminum Matrix +FR4

High Density Multilayers Back PCBs

Max layers: 24 layers
Max board thickness: 5.0mm
Max aspect ratio: 10:1
Min hole size: 0.4mm
Max size: 110*60mm
Min circuit gap/width: 4/4mil
Surface finishing: Immersion gold

RF/HF PCBs

Max thickness: 4.0mm
Min hole size: 0.4mm
Max size: 580*600mm
Max aspect ratio: 10:1
Surface finishing: Immersion gold

Gold Finger Multilayers PCB

Max layers: 28 layers
Max aspect ratio: 14:1
Min via hole: 0.2mm
Min circuit gap/width: 3/3mil
Surface finishing: Immersion gold + Flash Gold Impedance control: +/-10%

Multilayer FPC

Max layers: 12 layers
Max size: 850*310mm
Min via hole: 0.15mm
Min circuit gap/width: 3/3mil
Surface finishing: Immersion gold Impedance control: +/-10%

Rigid-flex PCBs

Layers: 6 layers
Thickness: 4.0mm
Size: 110*530mm
Max aspect ratio: 6:1
Electromagnetic shielding: 2L
Aluminum foil shielding: 2L
Min via hole: 0.25mm
Impedance control: +/-10%

Rigid-flex PCBs

Layers: 12 layers
hickness: 1.8mm
Size: 50*180mm
Max aspect ratio: 12:1
Circuit gap/width: 3/3mil
Min BGA: 6.4mil
Min via hole: 0.15mm
Impedance control: +/-10%

2/L OSP PCB

4/L IMS PCB

6/L HAL PCB

8/L IMG PCB

2/L IMG FPCB

4/L IMG FPCB

8/L IMG R/FPCB

Quality and Technical expertise

Quality System Certifications:

ISO9001-2015
ISO14001
IATF 16949
UL E301546
UL E473221

On-site Technical Support:

4 Engineering Teams
More Than 50 Engineers with Extensive Knowledge and Experience
Working Software : Genesis 2000; CAM350; Protel

Major Test Equipment

AOI
Flying Probe Tester
3-Dimension Tester
Copper Thickness Tester
Ion Contamination Tester
Gold plating Thickness Tester

Trace Width Tester
PIM Tester
Peeling Strength Tester
Impedance Tester
Metallurgical Microscopy
Spectrophotometer

Manufacturing Capabilities

Volume: 1-12 layers Sample: 20 layers
Maximum Board Thickness: 4.0mm
Material: FR4, HTG FR4, halogen free FR4, PTFE, FPC, Rogers, metal clad based, RF/HF and FR4 mixed material
Alignment Capability: +/- 2mil
Min Hole Size: 0.15mm
Max Production Size: 1200*600mm
Max Aspect Ratio: 10:1
Surface Finishing: HASL, lead free HASL, flash gold, immersion gold, immersion tin, immersion silver, OSP, plating tin ,carbon ink, hard gold
Special Technical: Countersink hole, counterbore hole, blind and buried hole, VIP design
Impedance Control: +/ 10%